Temperature analysis during bonding of brackets using LED or halogen light base units (2005)
Source: Photomedicine and Laser Surgery. Unidade: IFSC
Subjects: LASER, DENTE, ODONTOLOGIA, ÓPTICA
ABNT
SILVA, Paulo César Gomes et al. Temperature analysis during bonding of brackets using LED or halogen light base units. Photomedicine and Laser Surgery, v. 23, n. 1, p. 41-46, 2005Tradução . . Acesso em: 20 maio 2024.APA
Silva, P. C. G., Lizarelli, R. de F. Z., Moriyama, L. T., Porto Neto, S. de T., & Bagnato, V. S. (2005). Temperature analysis during bonding of brackets using LED or halogen light base units. Photomedicine and Laser Surgery, 23( 1), 41-46.NLM
Silva PCG, Lizarelli R de FZ, Moriyama LT, Porto Neto S de T, Bagnato VS. Temperature analysis during bonding of brackets using LED or halogen light base units. Photomedicine and Laser Surgery. 2005 ; 23( 1): 41-46.[citado 2024 maio 20 ]Vancouver
Silva PCG, Lizarelli R de FZ, Moriyama LT, Porto Neto S de T, Bagnato VS. Temperature analysis during bonding of brackets using LED or halogen light base units. Photomedicine and Laser Surgery. 2005 ; 23( 1): 41-46.[citado 2024 maio 20 ]